Biocompatible “click” wafer bonding for microfluidic devices

نویسندگان
چکیده

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Bonding of microfluidic devices fabricated in polycarbonate.

A simple method for bonding polycarbonate, based on controlled exposure of the pieces to vapours of solvents, yields a tight seal and unmodified geometry of the channels.

متن کامل

Wafer-to-Wafer Bonding for Microstructure Formation

Wafer-to-wafer bonding processes for microstructure fabrication are categorized and described. These processes have an impact in packaging and structure design. Processes are categorized into direct bonds, anodic bonds, and bonds with intermediate layers. Representative devices using wafer-to-wafer bonding are presented. Processes and methods for characterization of a range of bonding methods a...

متن کامل

Adhesive-based bonding technique for PDMS microfluidic devices.

We present a simple and inexpensive technique for bonding PDMS microfluidic devices. The technique uses only adhesive tape and an oven; plasma bonders and cleanroom facilities are not required. It also produces channels that are immediately hydrophobic, allowing formation of aqueous-in-oil emulsions.

متن کامل

Nanomechanical Optical Devices Fabricated with Aligned Wafer Bonding

This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance.

متن کامل

Hydrophobic silicon wafer bonding

Wafers prepared by an HF dip without a subsequent water rinse were bonded at room temperature and annealed at temperatures up to 1100 “C. Based on substantial differences between bonded hydrophilic and hydrophobic Si wafer pairs in the changes of the interface energy with respect to temperature, secondary ion mass spectrometry (SIMS) and transmission electron microscopy (TEM), we suggest that h...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Lab on a Chip

سال: 2012

ISSN: 1473-0197,1473-0189

DOI: 10.1039/c2lc21098c